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Solderless Breadboard – 830 Tie-Points
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Solderless Breadboard – 830 Tie-Points (1 Piece)
Key Features:
Total 830 tie-points:
630 in main grid (for components)
200 in power rails (100 on each side)
Solderless design – reusable and ideal for prototyping
Standard 2.54mm (0.1”) pitch spacing
Compatible with Arduino, Raspberry Pi, and other microcontrollers
Adhesive backing and mounting slots for stable placement
Accepts 20–29 AWG jumper wires and component leads
Specifications:
| Parameter | Value |
|---|---|
| Tie-points | 830 Total |
| Grid Type | 630 terminal strip + 200 bus |
| Contact Material | Phosphor Bronze (nickel plated) |
| Case Material | ABS Plastic |
| Dimensions | Approx. 17.5 × 5.5 × 1 cm |
| Mounting Option | Double-sided tape (pre-applied) |
| Reusability | 1000+ insertion cycles |
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